GP1000SF-0.040-02-0816 (or 1100SF)

PRODUCT DESCRIPTION
Thermally Conductive, Silicone-Free Gap Filling Material. 200 x 400mm sheet 1mm thick

FEATURES AND BENEFITS
● Thermal Conductivity: 0.9 W/m-K
● No silicone outgassing
● No silicone extraction
● Reduced tack on one side to aid in application assembly
● Electrically isolating

BERGQUIST GAP PAD TGP GP1000SF-0.040-02-0816 (or 1100SF) is a thermally
conductive, electrically insulating, silicone-free polymer
specially designed for silicone-sensitive applications. The
material is ideal for applications with high standoff and flatness
tolerances.

BERGQUIST GAP PAD TGP 1100SF is reinforced for easy
material handling and added durability during assembly. The
material is available with a protective liner on both sides of the
material. The topside has reduced tack for ease of handling.

TYPICAL APPLICATIONS
● Digital disk drives / CD-ROM
● Automotive modules
● Fiber optics modules

TYPICAL PROPERTIES OF CURED MATERIAL
Young’s modulus is calculated using 0.01 in/min, step rate of
strain with a sample size 0.79 inch².
Physical Properties
Hardness, Shore 00, Thirty second delay value,
ASTM D2240, Bulk rubber
40
Heat Capacity, ASTM E1269, J/g-K 1.1
Density, Bulk rubber, ASTM D792, g/cc 2.0
Flammability, UL 94 V-1
Young’s Modulus, ASTM D575 kPa 234
(psi) (34)
Electrical Properties
Dielectric Breakdown Voltage , ASTM D149, VAC >6,000
Dielectric Constant, ASTM D150, 1,000Hz 5.0
Volume Resistivity, ASTM D257, ohm-meter 1×1010
Thermal Properties
Thermal Conductivity, ASTM D5470, W/(m-K) 0.9

STORAGE
Store product in the unopened container in a dry location.
Storage information may be indicated on the product container
labeling.
Optimal Storage: 25ºC (±3), 50% RH (±10) for a 12 months
shelf life. Material removed from containers may be
contaminated during use. Do not return product to the original
container. Henkel Corporation cannot assume responsibility for
product which has been contaminated or stored under
conditions other than those previously indicated. If additional
information is required, please contact your local Technical
Service Center or Customer Service Representative.